DS20-GT targets ground terminal applications in wire harness production, delivering reliable joints with monitored, repeatable processing.
DS20-II is designed for ultrasonic wire-to-terminal joining in larger cross-sections, supporting monitored, traceability-ready production.
DS20-III Variant TF supports wire-to-terminal ultrasonic welding with repeatable results, monitoring, and production documentation.
GS-40-plus is designed for ultrasonic splicing up to 40 mm², focused on stable processing, monitoring and production integration.
GS-50-plus supports ultrasonic splicing up to 50 mm² with monitoring and documentation for traceability-ready production.
L-Splice 100-200 targets ultrasonic splicing in large cross-sections up to 100/200 mm² with monitoring and repeatability.
Minic-III is a compact ultrasonic wire splicing machine for copper and aluminium splices, designed for repeatable quality with process monitoring and data logging.
Minic-III Compacting provides controlled end compacting of copper and aluminium conductors for consistent preparation before the next process step.
Splice-Checker enables non-destructive quality checks of ultrasonic wire splices with result documentation and statistics.